Abstract
Dynamic and isothermal cure kinetics of three different formulations composed of a new tetraglycidyl epoxy resin and diaminodiphenyl sulfone (DDS) were analyzed by differential scanning calorimetry. An autocatalytic kinetic model with the overall reaction order of 2 was modified for adequately describing the cure kinetics. Compared to previous calculation of kinetic parameter, the modified calculation fitted well with the experimental results. Higher cure temperature and higher DDS concentration led to an increase in the cure rate. Cure process of epoxy was dependent on the structure and functional group of epoxy resin. At the low DDS concentration, second exotherm peak was observed at approximately 50% conversion. Dynamic kinetic parameters were larger than isothermal kinetic parameters.
Similar content being viewed by others
Article PDF
References
R. S. Bauer, “Epoxy Resin Chemistry I,” The American Chemical Society, Washington, D.C., 1979.
R. S. Bauer, “Epoxy Resin Chemistry II,” The American Chemical Society, Washington, D.C., 1983.
C. A. May and O. Tanaka, “Epoxy Resins Chemistry and Technology,” Marcel Dekker, Inc., New York and Basel, 1983.
G. Lubin, “Handbook of Composites,” 57–58, Van Nostrand Reinhold, New York, 1984.
C. A. May, “Epoxy Resin Chemistry and Technology,” Marcel Dekker, New York and Basel, 1988.
R. S. Bauer, A. G. Filippov, L. M. Schlaudt, and W. V. Breitigam, The Processings of 32nd International SAMPE Symposium, April 6–9, 1987, pp 1104–1113.
R. S. Bauer, A. G. Filippov, L. M. Schlaudt, and W. V. Breitigam, The Processings of 33rd International SAMPE Symposium, March 7–10, 1988, pp 1385–1393.
R. S. Bauer, The Proceedings of 34th International SAMPE Symposium, May 7–11, 1989, pp 1889–1990.
L. M. Schlaudt, R. S. Bauer and C. A. Blackburn, The Proceedings of 34th International SAMPE Symposium, May 8–11, 1989, pp 917–928.
L. Schechter, J. Wynstra, and R. P. Kurkjy, Ind. Eng. Chem., 48, 94 (1956).
T. Ozawa, Bull. Chem. Soc. Jpn., 38, 1881 (1965).
T. Ozawa, J. Therm. Anal., 2, 301 (1970).
A. A. Duswalt, Thermochim. Acta., 8, 57 (1974).
M. R. Kamal, S. Sourour, and M. Ryan, Soc., Plast. Eng. Tech. Papers, 19, 187 (1973).
S. Sorour and M. R. Kamal, Therms Chem. Acta., 14, 41 (1976).
A. Dutta, MSc Thesis, State University of N.Y. at Buffalo, Amherst, N.Y. (1970).
M. E. Ryan and A. Dutta, Polymer, 20, 203 (1979).
J. Mijovic, J. Kim, and J. Slaby, J. Appl. Polym. Sci., 29, 1449 (1984).
K. J. Morgan, J. A. Happe, and E. T. Mores, 28th National SAMPE Symposium Anaheim, Calif. April 12–14 (1983).
C. D. Doyle, Anal. Chem., 33, 77 (1961).
R. B. Prime, Polym. Eng. Sci., 13(5), 365–371 (1973).
R. B. Prime, “Thermal Characterization of Polymeric Materials,” E. A. Turi, Ed., Academic N.Y. 435–569 (1981).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Shim, J., Lee, W. & Jang, J. DSC Cure Studies of High Performance Epoxy Resins I. The Reaction with 4,4′-Diaminodiphenyl Sulfone (DDS). Polym J 23, 903–910 (1991). https://doi.org/10.1295/polymj.23.903
Issue Date:
DOI: https://doi.org/10.1295/polymj.23.903