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Volume 1 Issue 10, October 2018

Integrated devices get a little cooler

High-performance microthermoelectric coolers, which are composed of pairs of thermoelectric ‘legs’ and convert electricity into cooling, can be fabricated using methods compatible with the modern semiconductor industry. The cover shows a scanning electron microscopy image of the integrated microthermoelectric device, which has a packing density of around 5,000 leg pairs per cm2.

See Li et al. and News & Views by Vaughan

Image: Guodong Li, IFW Dresden. Cover Design: Allen Beattie.

Editorial

  • As the world of connected devices continues to expand, the need to develop more secure technology becomes increasingly relevant.

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Research Highlights

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News & Views

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Reviews

  • This Review Article examines state-of-the-art metrology methods for integrated circuits and highlights how new integrated circuit device design and industry requirements affect lithography options and consequently metrology requirements.

    • N. G. Orji
    • M. Badaroglu
    • A. E. Vladar
    Review Article
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Research

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Reverse Engineering

  • The spanning tree protocol is a key component of today’s Ethernet. Radia Perlman, inventor of the underlying algorithm, recounts how it was first developed.

    • Radia Perlman
    Reverse Engineering
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